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显示设备

了解成就ICD世界首创的显示设备自主技术、工艺与量产设备。

显示设备 / 生产系统

从大面积量产设备 到研发用蒸镀系统。

Production experience in OLED, LTPO, LTPS and Oxide TFT connects etch, ashing, surface treatment and deposition in one equipment portfolio.

ICP DRY Etcher

Display Pattern Etching for OLED and LCD
查看技术信息
ICP DRY Etcher Plasma Etching / Ashing for OLED & LCD

OLED Plasma Treatment System

Plasma Treatment Before OLED Evaporation
查看技术信息
OLED Plasma Treatment System Plasma Ashing System Before OLED Evaporation

Technical Information

01

PROCESS

  • Plasma Treatment
  • Organic / Metal Deposition
  • Encapsulation
02

APPLICATIONS

  • Mobile: AMOLED · LTPS · LTPO Patterns
  • TV: AMOLED · LTPS · QD · TFT-LCD Patterns
  • Target: a-Si · Poly-Si · SiO₂ · SiNₓ · Gate · S/D · LTPS All Layers
  • Mass Production Gen.: 2 · 3 · 3.5 · 4.5 · 5 · 5.5 · 6 · 6H · 8.5 · 10.5
03

INTRODUCTION

  • A plasma etching and ashing system that generates plasma inside a chamber to etch thin-film patterns and form electrical circuits.
  • The ICD ICP DRY Etcher is optimized for manufacturing organic light-emitting diode (OLED) and liquid crystal displays (LCD).
04

TECHNOLOGY

  • Process gas and RF power generate plasma in a vacuum chamber for physical and chemical dry etching of thin films on glass substrates
  • Equipment line-up for AMOLED, QD, LTPS, LTPO, Oxide TFT and TFT-LCD applications
  • High production capability, etch rate and uniformity
  • MURA, ESD, ARC and Dint suppression
05

FEATURES

  • High MTBF Values
  • Excellent Particle Defect Control
  • Excellent PM Cycle

Technical Information

01

PROCESS

  • Plasma Treatment (Plasma Ashing System Before OLED Evaporation)
02

APPLICATIONS

  • Mass Production Line: VT1500 (6GH)
  • Mass Production Line: A400 (2G)
  • Mass Production Line: A700 (4.5GH)
  • Mass Production Line: A750 (5.5GQ)
03

INTRODUCTION

  • A core plasma treatment system for OLED production lines before evaporation.
  • Recognized by major panel manufacturers in Korea and overseas for its product performance and mass-production capability, the system has established a strong position in pre-evaporation plasma treatment.
04

TECHNOLOGY

  • Process gas and RF power in a vacuum chamber enable physical and chemical etching of target materials on glass
  • PE Mode: Uniformity control through anode/cathode spacing and gas flow
  • ICP Mode: Local uniformity control through VVC and coil-step adjustment
05

FEATURES

  • Excellent particle control [Common]
  • Excellent PM cycle [Common]
  • Excellent ESD control [Common]