
BDF Etcher
Plasma processing for BDF vias and fine-pitch RDL
- PROCESS
- Via-hole plasma drilling
- UNIFORMITY
- Within / across substrate
- PRODUCTIVITY
- High throughput
PRECISION IN THE INVISIBLE
From the world-first CiM to large-area etch proven in OLED production, ICD turns processes no one has built before into standards ready for semiconductor, packaging and display manufacturing.
EQUIPMENT PORTFOLIO
Explore production-proven systems spanning advanced packaging, semiconductor front-end and display manufacturing.
View equipment detailsMore than 25 years of OLED production experience converge with proprietary plasma engineering. By integrating source, chamber, ESC and recipe, ICD delivers etch outcomes that are distinctly its own.
Explore proprietary ICD platforms engineered to turn world-first processes into production reality.
Plasma expertise proven in display production, extended into semiconductor front-end and glass interposer processes.

Hybrid ashing engineered for throughput and Low-k protection
Independent command of plasma, vacuum, ion energy and temperature creates process results that are difficult to replicate.

A proprietary source forms uniform high-density plasma across the wafer while limiting process damage.
ANSEONG · KOREA37°00'N / 127°16'EAt our integrated Anseong campus, plasma source, process, mechanical and control teams develop as one. ICD's relentless loop between design and field validation sets a new benchmark for etch.
From Anseong to customer fabs worldwide, one ICD team protects the process precision that makes every singular etch result possible.
All continents and our key customer network.
From display to advanced packaging, ICD technology connects with customer sites worldwide.