BDF
Via and Fine-Interconnect Etching for Advanced Packaging
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设备·技术
了解成就ICD世界首创的设备·技术自主技术、工艺与量产设备。
适合工艺的设备，一目了然。
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半导体设备
先进封装
Systems for fine-interconnect processing and dielectric film deposition in advanced packaging.
半导体设备
半导体前道
Precision wafer etching, photoresist stripping and residue removal.
显示设备
Display pattern etching, pre-evaporation treatment, vacuum transfer and research deposition.
ESC及零部件
Electrostatic chucks for substrate clamping and temperature control across process applications.