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Dry Etch
Dry Etch Advanced ESC
| Process | Metal / Non-Metal |
|---|---|
| Cooling | +30% (vs. Conventional) |
| Generation | Up to Gen 8.6 |
| ESC Type | Unipolar |
MATERIALS · SURFACE TREATMENT · COMPONENTS
Display AMOLED ESC Technology & Product Portfolio
针对AMOLED刻蚀、蒸镀与薄膜工艺优化的ESC产品
Dry Etch
| Process | Metal / Non-Metal |
|---|---|
| Cooling | +30% (vs. Conventional) |
| Generation | Up to Gen 8.6 |
| ESC Type | Unipolar |
PVD / Sputtering
| Process | Sputter / PVD |
|---|---|
| Function | GLS Slip / Cooling |
| Generation | Up to Gen 8.6 |
| ESC Type | Bipolar |
CVD Process
| Process | CVD |
|---|---|
| Max. Temperature | Up to 300 ℃ |
| RF Power | ~ 0.6 W/cm² |
| ESC Type | Bipolar |
Evaporation (OLED)
| Process | Evaporation (OLED) |
|---|---|
| Flatness Control | ≤ 50 ㎛ |
| Generation | Up to Gen 8.6-h |
| ESC Type | Bipolar |
Semiconductor ESC Technology & Product Portfolio
按工艺温度优化的ESC产品与Multi-Zone温控技术
PVD / Sputter / Etch
−40 ℃ ~ 20 ℃
PVD / Sputter / Etch
20 ℃ ~ 80 ℃
Metal Deposition / Metal Etch
80 ℃ ~ 150 ℃
CVD / High Temp Process
150 ℃ ~
不同ESC结构的温度均匀性比较

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ICD Materials于2018年6月1日从ICD公司分拆设立,主要从事AMOLED及LCD设备用静电吸盘(ESC)设备的制造与销售,总部及工厂位于韩国京畿道安城市大德面。
公司依据《促进风险企业特别措施法》第25条的规定,获得韩国中小企业厅的风险企业认证。
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涵盖材料、表面处理与零部件的Component Total Solution

材料开发、自主设计、热喷涂、自主加工与研磨技术

APS、SPS、G-APS及功能涂层的微观结构与性能比较
