ICP DRY Etcher
Display Pattern Etching for OLED and LCD
Equipment & Technology
Display Equipment
Explore the proprietary Display Equipment technology and production platforms behind ICD world firsts.
DISPLAY EQUIPMENT / PRODUCTION SYSTEMS
From large-area production tools to research deposition systems.
Production experience in OLED, LTPO, LTPS and Oxide TFT connects etch, ashing, surface treatment and deposition in one equipment portfolio.
View technical data
OLED Plasma Treatment System
Plasma Treatment Before OLED Evaporation
Technical Information
PROCESS
- Plasma Treatment
- Organic / Metal Deposition
- Encapsulation
APPLICATIONS
- Mobile: AMOLED · LTPS · LTPO Patterns
- TV: AMOLED · LTPS · QD · TFT-LCD Patterns
- Target: a-Si · Poly-Si · SiO₂ · SiNₓ · Gate · S/D · LTPS All Layers
- Mass Production Gen.: 2 · 3 · 3.5 · 4.5 · 5 · 5.5 · 6 · 6H · 8.5 · 10.5
INTRODUCTION
- A plasma etching and ashing system that generates plasma inside a chamber to etch thin-film patterns and form electrical circuits.
- The ICD ICP DRY Etcher is optimized for manufacturing organic light-emitting diode (OLED) and liquid crystal displays (LCD).
TECHNOLOGY
- Process gas and RF power generate plasma in a vacuum chamber for physical and chemical dry etching of thin films on glass substrates
- Equipment line-up for AMOLED, QD, LTPS, LTPO, Oxide TFT and TFT-LCD applications
- High production capability, etch rate and uniformity
- MURA, ESD, ARC and Dint suppression
FEATURES
- High MTBF Values
- Excellent Particle Defect Control
- Excellent PM Cycle
Technical Information
PROCESS
- Plasma Treatment (Plasma Ashing System Before OLED Evaporation)
APPLICATIONS
- Mass Production Line: VT1500 (6GH)
- Mass Production Line: A400 (2G)
- Mass Production Line: A700 (4.5GH)
- Mass Production Line: A750 (5.5GQ)
INTRODUCTION
- A core plasma treatment system for OLED production lines before evaporation.
- Recognized by major panel manufacturers in Korea and overseas for its product performance and mass-production capability, the system has established a strong position in pre-evaporation plasma treatment.
TECHNOLOGY
- Process gas and RF power in a vacuum chamber enable physical and chemical etching of target materials on glass
- PE Mode: Uniformity control through anode/cathode spacing and gas flow
- ICP Mode: Local uniformity control through VVC and coil-step adjustment
FEATURES
- Excellent particle control [Common]
- Excellent PM cycle [Common]
- Excellent ESD control [Common]