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디스플레이 장비

세계 최초를 만드는 ICD의 디스플레이 장비 기술, 독자 공정과 양산 장비를 확인합니다.

디스플레이 장비 / 양산·연구 시스템

대면적 양산 장비에서 연구용 증착 시스템까지.

Production experience in OLED, LTPO, LTPS and Oxide TFT connects etch, ashing, surface treatment and deposition in one equipment portfolio.

ICP DRY Etcher

Display Pattern Etching for OLED and LCD
기술 정보 보기
ICP DRY Etcher Plasma Etching / Ashing for OLED & LCD

OLED Plasma Treatment System

Plasma Treatment Before OLED Evaporation
기술 정보 보기
OLED Plasma Treatment System Plasma Ashing System Before OLED Evaporation

Technical Information

01

PROCESS

  • Plasma Treatment
  • Organic / Metal Deposition
  • Encapsulation
02

APPLICATIONS

  • Mobile: AMOLED · LTPS · LTPO Patterns
  • TV: AMOLED · LTPS · QD · TFT-LCD Patterns
  • Target: a-Si · Poly-Si · SiO₂ · SiNₓ · Gate · S/D · LTPS All Layers
  • Mass Production Gen.: 2 · 3 · 3.5 · 4.5 · 5 · 5.5 · 6 · 6H · 8.5 · 10.5
03

INTRODUCTION

  • A plasma etching and ashing system that generates plasma inside a chamber to etch thin-film patterns and form electrical circuits.
  • The ICD ICP DRY Etcher is optimized for manufacturing organic light-emitting diode (OLED) and liquid crystal displays (LCD).
04

TECHNOLOGY

  • Process gas and RF power generate plasma in a vacuum chamber for physical and chemical dry etching of thin films on glass substrates
  • Equipment line-up for AMOLED, QD, LTPS, LTPO, Oxide TFT and TFT-LCD applications
  • High production capability, etch rate and uniformity
  • MURA, ESD, ARC and Dint suppression
05

FEATURES

  • High MTBF Values
  • Excellent Particle Defect Control
  • Excellent PM Cycle

Technical Information

01

PROCESS

  • Plasma Treatment (Plasma Ashing System Before OLED Evaporation)
02

APPLICATIONS

  • Mass Production Line: VT1500 (6GH)
  • Mass Production Line: A400 (2G)
  • Mass Production Line: A700 (4.5GH)
  • Mass Production Line: A750 (5.5GQ)
03

INTRODUCTION

  • A core plasma treatment system for OLED production lines before evaporation.
  • Recognized by major panel manufacturers in Korea and overseas for its product performance and mass-production capability, the system has established a strong position in pre-evaporation plasma treatment.
04

TECHNOLOGY

  • Process gas and RF power in a vacuum chamber enable physical and chemical etching of target materials on glass
  • PE Mode: Uniformity control through anode/cathode spacing and gas flow
  • ICP Mode: Local uniformity control through VVC and coil-step adjustment
05

FEATURES

  • Excellent particle control [Common]
  • Excellent PM cycle [Common]
  • Excellent ESD control [Common]