A plasma etching and ashing system that generates plasma inside a chamber to etch thin-film patterns and form electrical circuits.
The ICD ICP DRY Etcher is optimized for manufacturing organic light-emitting diode (OLED) and liquid crystal displays (LCD).
04
TECHNOLOGY
Process gas and RF power generate plasma in a vacuum chamber for physical and chemical dry etching of thin films on glass substrates
Equipment line-up for AMOLED, QD, LTPS, LTPO, Oxide TFT and TFT-LCD applications
High production capability, etch rate and uniformity
MURA, ESD, ARC and Dint suppression
05
FEATURES
High MTBF Values
Excellent Particle Defect Control
Excellent PM Cycle
Technical Information
01
PROCESS
Plasma Treatment (Plasma Ashing System Before OLED Evaporation)
02
APPLICATIONS
Mass Production Line: VT1500 (6GH)
Mass Production Line: A400 (2G)
Mass Production Line: A700 (4.5GH)
Mass Production Line: A750 (5.5GQ)
03
INTRODUCTION
A core plasma treatment system for OLED production lines before evaporation.
Recognized by major panel manufacturers in Korea and overseas for its product performance and mass-production capability, the system has established a strong position in pre-evaporation plasma treatment.
04
TECHNOLOGY
Process gas and RF power in a vacuum chamber enable physical and chemical etching of target materials on glass
PE Mode: Uniformity control through anode/cathode spacing and gas flow
ICP Mode: Local uniformity control through VVC and coil-step adjustment